Kopin Achieves 3 Critical Milestones Advancing US Army Color MicroLED Technology for Ground Soldier Vision Applications

July 14, 2026

Kopin Corporation (NASDAQ: KOPN), a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, enterprise, industrial, consumer and medical products, today announced three major milestone achievements in its color MicroLED development program for the U.S. Government's Industrial Base Analysis and Sustainment (IBAS) program. These accomplishments represent significant progress toward establishing a fully U.S. based MicroLED manufacturing capability and advancing next generation soldier vision systems.

Milestone 1: Breakthrough MicroLED Performance Achieved
Kopin achieved a significant performance milestone, reaching over 150,000 nits of single-panel, full-color brightness-exceeding the program's threshold target. This early performance result demonstrates strong initial capability, with planned improvements expected to push brightness even higher over time.

These results represent a major step forward in the development of high brightness, defense ready MicroLED displays suitable for advanced vision systems, augmented reality, and other mission critical applications.

Milestone 2: Progress Toward Full Color MicroLED Integration for Ground Soldier Integrated Vision Systems
Kopin has reached a second crucial milestone: successful early integration progress of its color MicroLED technology for U.S. Army ground soldier vision applications. This advancement brings Kopin closer to enabling future soldier borne systems such as the SBMC solution, where lightweight, high brightness, full color MicroLED displays are essential for real time situational awareness, digital overlays, and mission execution.

This milestone reflects Kopin's ability to translate MicroLED performance gains into application specific optical solutions designed for rugged, field ready soldier systems.

Milestone 3: U.S. Bonding Equipment Delivered and Installed
Kopin has received and begun installation of its new MicroLED bonding equipment, a key asset supporting the IBAS program and Kopin's broader effort to onshore critical MicroLED manufacturing processes. The equipment shipped in June and is scheduled to be fully installed by the end of July at Kopin's U.S. headquarters.

This advanced bonding system enables the precise attachment of the backplane to the MicroLED array, creating a fully bonded display assembly-an essential step in MicroLED production. With this installation, Kopin will have U.S. based bonding capability, a foundational requirement for scaling domestic MicroLED manufacturing.

Kopin expects to transition to manufacturing product in mid 2027, positioning the company as a key U.S. supplier of next generation MicroLED display technology.

Management Commentary
"Our team has delivered three major achievements that accelerate our path toward U.S. based MicroLED manufacturing, and next generation display performance," said Michael Murray, CEO of Kopin Corporation. "Receiving and installing our bonding equipment is a foundational step in onshoring MicroLED production, surpassing 150,000 nits of single-panel, full-color brightness demonstrates the strength of our technology roadmap, and our integration progress for Kopin's support of the IBAS initiative and moves us closer to enabling future programs like SBMC which could enable hundreds of millions in revenues for Kopin over the life of the program. These milestones reinforce Kopin's commitment to building advanced display capabilities here in the United States and leading the future of high performance MicroLED systems."

Source : Kopin Corporation