September 30, 2024
-Lockheed Martin (NYSE: LMT) in collaboration with Altera, an Intel Company, completed a successful flight demonstration of our 12th Generation Electronic Warfare (Gen12) transceiver utilizing Altera’s Agilex™ 9 Direct RF FPGA (Multi-Chip Package, MCP-2).
The project, coined SWIFT (SHIP-enabled Wideband Transceiver Integrated Flight Test) by the Office of the Under Secretary of Defense for Research and Engineering (OUSD-R&E), established an aggressive requirement for Lockheed Martin to perform an electronic warfare flight demonstration utilizing Altera’s FPGA aboard a Group 2 Unmanned Air Vehicle (UAV) in less than 12 months.
Conducted at the U.S. Army’s Yuma Proving Ground, the SWIFT demonstration represented the first time Lockheed Martin used the Altera Direct RF FPGA in a government test environment, showcasing the device’s readiness to perform real-world missions. The event successfully proved the Gen12’s Electronic Support (ES) capability by performing the detect, identify and locate mission against real enemy emitters in a DoD relevant environment.
Through the success of this demonstration, Lockheed Martin and Altera proved how size, weight and power (SWaP) constrained airborne platforms can be utilized to deliver electronic warfare effects, while also allowing growth for new capabilities. The technology enables a low SWaP, Sensor Open System Architecture (SOSA) aligned digital transceiver that performs the Electronic Support (ES) and Electronic Attack (EA) missions using domestically produced semiconductors.
This demonstration serves as a proof point for the importance of OUSD-R&E State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program and the ongoing need for sustainable U.S.-made microelectronics packages customized for DoD applications.
The Big Picture
Strategic Perspectives
“This demonstration signifies an important step forward for Lockheed Martin’s strategic partnership with OUSD-R&E and Altera on ensuring warfighter access to state-of-the-art, U.S.-made microelectronics,” said Dr. Steven Walker, vice president and chief technology officer at Lockheed Martin. “The SHIP program’s transformative influence on DoD capabilities bolsters confidence in these ongoing advancements and paves the way for their integration throughout the military in support of our customers’ most critical missions.”
“Altera’s proud to participate in Lockheed Martin’s demonstration along with OUSD-R&E SHIP program. Leveraging decades of leadership in chiplet development and manufacturing has led to the rapid readiness and availability of production quality, SWAP-centric MCP-2 products for future mission requirements.” said John Sotir, Senior Director, Military Aerospace and Government Business and State-of-the-Art Heterogeneous Integration Packaging (SHIP).
What’s Next?
Background
Source : Lockheed Martin Corporation
Publish date: June 2022 - Pages: 204